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Photonic Packaging R&D Engineer H/F

Vacancy details

General information


The French Alternative Energies and Atomic Energy Commission (CEA) is a key player in research, development and innovation in four main areas :
• defence and security,
• nuclear energy (fission and fusion),
• technological research for industry,
• fundamental research in the physical sciences and life sciences.

Drawing on its widely acknowledged expertise, and thanks to its 16000 technicians, engineers, researchers and staff, the CEA actively participates in collaborative projects with a large number of academic and industrial partners.

The CEA is established in ten centers spread throughout France



Division description

Based in Grenoble, France, CEA-LETI is one of the largest Research & Technology Organization dedicated to Microelectronics and Photonics. Its Optics and Photonics Division develops new concepts and processes in various fields, including IR and visible image sensors, Silicon Photonics, Optical Sensors, Displays, and also emerging applications such as quantum computing, biotechnologies and automotive.

Description de l'unité

The main mission of the Photonic Packaging Laboratory is to enable smart integration of high end optoelectronic chips into modules, enabling functional testing, with enhanced performances and reduced footprints. To reach this goal, we aim at introducing co-design, novel packaging building blocks and advanced assembly processes.

Position description


Optics and Optronics


Permanent contract

Job title

Photonic Packaging R&D Engineer H/F

Socio-professional category


Job description

In a context of increasing activity, we are looking for a Photonic Packaging Engineer. He/She will be embedded in a team of 30 skilled people and will be in charge of developing new modules architectures, by taking in charge the design and the introduction of novel advanced packaging technologies within the assembly flow, in a project-oriented context. As a task leader, he/she will be in strong relationship with the Project leader (internal customer) and will organize the technical activity of its packaging team.

He/She will qualify and optimize the assembly technologies needed to get the proofs of concept or prototypes (flip-chip, wire-bonding, pick and place, substrates designs, …) according to the specifications, organize Design of Experiments to assess the technical choices or new introduced technologies [FL11] (MID, imprint, etc…) and will drive morphological or functional characterizations.

Applicant Profile

With a recognized experience (>5 years) in the field of packaging and microelectronics assembly , he/she will be proposing new solutions in order to increase the miniaturization and the performances of the modules. Additional skills in the field of multiphysics simulation (thermomechanical, optical, RF, thermal) is a must. The candidate should be also able to operate the assembly equipment in the lab, in a clean room environment, and to propose new directions of developments.

 Finally, strong communication and inter-personal relationship skills are needed, as he/she will cooperate and interact with internal and external partners.


Position location



Job location

France, Auvergne-Rhône-Alpes, Isère (38)



Candidate criteria

Recommended training



Position start date