Photonic Packaging Senior Engineer H/F

Vacancy details

General information


The French Alternative Energies and Atomic Energy Commission (CEA) is a key player in research, development and innovation in four main areas :
• defence and security,
• nuclear energy (fission and fusion),
• technological research for industry,
• fundamental research in the physical sciences and life sciences.

Drawing on its widely acknowledged expertise, and thanks to its 16000 technicians, engineers, researchers and staff, the CEA actively participates in collaborative projects with a large number of academic and industrial partners.

The CEA is established in ten centers spread throughout France



Division description

Based in Grenoble, France, CEA-LETI is one of the largest Research & Technology Organization dedicated to Microelectronics and Photonics. Its Optics and Photonics Division develops new concepts and processes in various fields, including IR and visible image sensors, Silicon Photonics, Optical Sensors, Displays, and also emerging applications such as quantum computing, biotechnologies and automotive.

Description de l'unité

The main mission of the Photonic Packaging Laboratory is to enable smart integration of high end optoelectronic chips into modules, enabling functional testing, with enhanced performances and reduced footprints. To reach this goal, we aim at introducing co-design, novel packaging building blocks and advanced assembly processes. Our main research axis are in fine pitch interconnects, photonic-electronic co-integration, microoptics and fiber optic assembly, and module integration (including cryogenic systems).

Position description


Optics and Optronics


Permanent contract

Job title

Photonic Packaging Senior Engineer H/F

Socio-professional category


Job description

In a context of increasing activity, we are looking for a Photonic Packaging Senior Engineer. He/She will be embedded in a team of 30 skilled people and will be in charge of developing new research topics within the lab, in an R&D context, with strong challenges in the field of photonic-electronic integration, e.g. miniaturization, complexity, process throughput and co-design.

With a strong experience (>15 years) in the field of packaging and microelectronics assembly , he/she will be proposing new research and development topics, fitting with LETI’s application and technology roadmaps. He/She will lead the activity by submitting project proposals, organizing the work within dedicated teams, and communicating results through scientific papers and patents. As an expert in the field of packaging, he/she will propose solutions and improvements in the packaging process, and participate in proactive team efforts to achieve program goals.

The proposed developments will rely on the Photonic Packaging platform (70 equipment in a cleanroom environment) , LETI’s 200mm & 300mm CMOS and MEMS platform (wafer processing), and external partnerships (subcontractors, academic & industrial partners).

Applicant Profile

A deep knowledge of the packaging technologies (flip-chip, BEOL process, microelectronics assembly) is needed as well as skills in the field of co-conception and simulation. Willingness to apply fundamental science and engineering concepts in development to create novel solutions is a must. Strong communication and inter-personal relationships skills are needed, as he/she will cooperate and interact with internal and external partners.

Position location



Job location

France, Auvergne-Rhône-Alpes, Isère (38)




Position start date