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Microelectronic 3DIC CAD Engineer H/F


Vacancy details

General information

Organisation

The French Alternative Energies and Atomic Energy Commission (CEA) is a key player in research, development and innovation in four main areas :
• defence and security,
• nuclear energy (fission and fusion),
• technological research for industry,
• fundamental research in the physical sciences and life sciences.

Drawing on its widely acknowledged expertise, and thanks to its 16000 technicians, engineers, researchers and staff, the CEA actively participates in collaborative projects with a large number of academic and industrial partners.

The CEA is established in ten centers spread throughout France
  

Reference

2024-31290  

Position description

Category

Micro and nano technologies

Contract

Fixed-term contract

Job title

Microelectronic 3DIC CAD Engineer H/F

Socio-professional category

Executive

Contract duration (months)

36 mois

Job description

Within CEA Grenoble, the integrated circuit design platform is one of Europe’s leading technological research design center specialized in digital, analog, mixed-signal and radiofrequency component circuit and system design.

 3D heterogeneous and monolithic integrations allows mixing different CMOS technologies, to offer the best system performance trade-offs. Chiplet-based architecture allows building efficiently larger systems in a plug&playing manner. CEA has a strong experience in designing 3D  & chiplet circuits, and is aiming at strengthening its design team and competence center, for various application domains: High Performance Computing, embedded AI accelerator, IoT, Smart Sensors, Quantum computer.

 

Responsibilities

Build and maintain an up-to-date 3DIC design environment for digital and mixed circuit designs.

  • support internal teams and deploy 3D flows for different application domains : HPC, AI accelerators, Sensors, IoT, RF, Memory computing, Imager, photonics, Quantum computer, etc
  • maintain design flows and interact with major CAD vendors, such as Cadence, Siemens, Synopsys, Keysight, Altair, etc
  • interact with front-end and back-end designers to build and enhance the methodologies routines for design automation,   
  • target multiple foundries from mature to advanced process regarding the projects requirements,
  • propose and build system environment for IC simulation and verification including : assembly, package, PCB ..etc )
  • work with design teams to participate actively to the design test-cases of Multi-Die topologies using advanced innovative 3D technologies, covering the different 3D flow steps : Physical Implementation and Sign-off (DRC, LVS, PEX, Power & Signal Integrity, Thermal Analysis)
  • contribute to 3D flow maintainability, including tool releases notes, design guidelines, methodologies for full digital, mixed signals and analog circuits. 

Applicant Profile

  • Master's or PhD degree with one or two years professional working experience
  • Familiarity with digital ASIC design flows, and associated EDA tools and their interoperability
  • Knowledge of operating system and scripting languages, such as sh, csh, tcl/tk, perl, and others.

Position location

Site

Grenoble

Job location

France, Auvergne-Rhône-Alpes, Isère (38)

Location

  Grenoble

Candidate criteria

Languages

English (Bilingual)

Recommended training

Master's or PhD degree

Requester

Position start date

01/07/2024